Tinned Copper Wire Mesh
Tinned copper wire mesh is a product that undergoes a tinning treatment on its surface. It is formed by first weaving high-quality copper wires into a mesh structure, followed by applying a layer of tin through a specific process.
Description
Tinned Copper Wire Mesh is a metallic mesh material woven from pure copper wires coated with a tin layer. The base material is high-purity copper (typically ≥99.9%), with a uniform tin protective layer (tin content approximately 5-20%) applied to the copper wires through electroplating or hot-dip tinning processes. This tin coating significantly enhances the wire’s oxidation and corrosion resistance, particularly against moisture, salt spray, and weak acidic/alkaline environments.
Brief introductions of the tinned copper mesh size:
—Mesh size: 1-200 mesh; Roll size: 1*30m
Features of tinned copper mesh:
- Excellent Conductivity: Retains copper’s high conductivity (≥95% IACS), ideal for electromagnetic shielding, grounding grids, etc.
- Enhanced Corrosion Resistance: The tin layer isolates copper from air/water, preventing oxidation and extending service life.
- Improved Solderability: The tin-coated surface facilitates soldering, enhancing connections in electronic components.
- Flexibility & Durability: Maintains copper’s ductility and can be woven into flexible meshes with varying densities (e.g., 60-200 mesh).
Primary Applications of tinned copper wire mesh:
- Electronics & Electrical: PCB shielding layers, grounding arrays, cable braiding.
- Marine Engineering: Anti-corrosion filters for ship equipment, components in desalination systems.
- Industrial Filtration: Screening of chemical/acidic liquids, food-grade filtration (compliant with FDA standards).
- Architectural Design: Decorative meshes with conductive and anti-oxidation properties.
Compared to standard copper mesh, its rust resistance is improved by 3-5 times, and it offers a lower cost than silver-plated alternatives, making it a cost-effective solution for corrosion-resistant conductive applications.
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